| 摘要 |
<P>PROBLEM TO BE SOLVED: To very efficiently and quickly extract a hot spot, using a relative reference value (a first value) common to all the layers constituting an element, in a design stage, when manufacturing a highly reliable electronic device. <P>SOLUTION: A simulation figure of each design figure is prepared by performing exposure simulation on the design figure classified by a grouping part 2.A space and width of the prepared simulation figure are measured. A histogram is prepared for each design figure, based on the measured space and width of the simulation figure. The hot spot is determined based on the histogram, to correct a layout around the hot spot of the design figure. <P>COPYRIGHT: (C)2011,JPO&INPIT |
