| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem wherein damage is accumulated on the surface of a terminal section in an etching process, and failure, such as an increase in contact resistance and a decrease in adhesiveness, occurs since the terminal section that becomes a region electrically connected to the outside of a photoelectric converter is exposed to a dry etching atmosphere of a photodiode, a fluoric-acid-based wet etching atmosphere of a passivation layer, and the like during the manufacturing process and is also exposed to a plasma ashing atmosphere following separation of resist in each process. <P>SOLUTION: For preventing accumulation of damage on the surface of a terminal section 10B by an etching process during a manufacturing process, an inorganic planarization layer 202 is allowed to remain until the final etching process (before a process for establishing a contact with the terminal section 10B). Damage by the etching process is absorbed by the inorganic planarization layer 202, thus preventing unneeded accumulation of damage to the terminal section 10B. <P>COPYRIGHT: (C)2011,JPO&INPIT |
