摘要 |
PROBLEM TO BE SOLVED: To provide a sensor element-mounting package having the upper surface of a wiring board covered with a lid having a bent opposite surface part and attached by fitting part of the opposite surface part in a recessed part formed on its external surface, the board being prevented from chipping and so on during the attachment and the lid having no backlash after the attachment. SOLUTION: The sensor element-mounting package is provided with: a downward extension part 167 provided to each opposite surface part 163 of the lid 160; and a lateral-end directed extension part 168 having a tip apart from the extension part. Each lateral-end directed extension part 168 is pressed from outside and deformed, after the lid 160 is placed to cover the upper surface of the board 110 with the lid 160 to partially enter the recessed part 137 and to abut against or come into pressure-contact with the lateral-end side corner part 134c of a lateral end of the recessed part 137. Since the lateral-end directed extension part 168 is bent to enter the recessed part 137, after being covered with the lid, it is hardly damaged, and since it is made to abut against or come into pressure-contact with the lateral-end side corner part 134c, the backlash is hardly caused. COPYRIGHT: (C)2011,JPO&INPIT
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