| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic copper plating bath containing an inhibitor, a promoter and a smoothing agent as indispensable effective components by which copper can be satisfactorily embedded in a groove and a hole by electrolytic copper plating even in a fine structure and to provide an electrolytic copper plating method using the electrolytic copper plating bath. SOLUTION: The electrolytic copper plating bath contains 0.001 to 5 mass% inhibitor comprising a predetermined block copolymer compound, 0.01 to 100 mass ppm predetermined promoter and 0.01 to 250 mass ppm at least one smoothing agent selected from a salt of diallyl amine and sulfuric acid compound-maleic acid copolymer, a salt of a vinyl pyrrolidone-N, N-dimethylaminoethyl methacrylic acid copolymer and a sulfuric acid compound, a chlorinated methylvinyl imidazolium-vinylpyrrolidone copolymer, and N-acyl-N'-carboxyethyl-N'-hydroxyethyl ethylene diamine or its alkali metal salt (acyl denotes a 8-20C aliphatic acyl group). COPYRIGHT: (C)2011,JPO&INPIT |
