发明名称 |
MOTHERBOARD AND MOTHERBOARD LAYOUT METHOD |
摘要 |
A motherboard layout method includes positioning two electronic elements on a top layer of a motherboard, and positioning another two electronic elements on a bottom layer of the motherboard, connecting one end of a first electronic element on the top layer to the same end of a first electronic element on the bottom layer with a first via hole, and connecting the same end of a second electronic element on the top layer to the same end of a second electronic element on the bottom layer with a second via hole. The method further includes connecting the other ends of the two electronic elements on the top layer to a first part, and connecting the other ends of the two electronic elements on the bottom layer to a second part.
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申请公布号 |
US2010277882(A1) |
申请公布日期 |
2010.11.04 |
申请号 |
US20090503680 |
申请日期 |
2009.07.15 |
申请人 |
HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
PAI CHIA-NAN;CHEN HAN-LONG;LI NING;HSU SHOU-KUO |
分类号 |
H05K1/18;H05K3/30 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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