| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus and a sputtering method increasing uniformity of film thickness and film quality of a thin film to be formed on a large scale substrate in a substrate surface by small a magnetron sputtering cathode. SOLUTION: The sputtering apparatus includes: a rotatable substrate holder 7 on which a substrate 8 is loaded; and a plurality of sputtering cathodes 203a, 203b having targets 201a, 201b consisting of the same kind of deposition material from a center axis 9 of the substrate holder 7 toward the outer peripheral direction. In the sputtering apparatus, area of the target 201b of the sputtering cathode 203b installed on the outer peripheral side is set as larger than area of the target 201a of the sputtering cathode 203a installed on the inner peripheral side. COPYRIGHT: (C)2011,JPO&INPIT
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