发明名称 WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board that suppresses water permeation from a boundary part between a ferrite layer and a side face electrode and a boundary part between the ferrite layer and a connection electrode and is highly electrically reliable as a result. <P>SOLUTION: The wiring board 10 includes glass ceramic layers 1, ferrite layers 2 provided between the glass ceramic layers 1, connection conductors 5 connected to inside interconnects 6 formed between the ferrite layers 2 and led out to side faces of the ferrite layers 2 from between the ferrite layers 2, interposed layers 3 containing a glass material and the same ferrite material as the ferrite layers 2 and covering peripheries of the connection conductors 5 led out to the side faces of the ferrite layers 2, and side face electrodes 4 connected to the connection conductors 5 while covering the led-out connection conductors 5 and interposed layers 3. The side face electrodes 4 and interposed layers 3, and connection conductors 5 and interposed layers 3 are attached to each other, so that permeation of water from between the side face electrodes 4 and interposed layers 3, and between connection conductors 5 and interposed layers 3 is suppressed. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010251691(A) 申请公布日期 2010.11.04
申请号 JP20090194927 申请日期 2009.08.26
申请人 KYOCERA CORP 发明人 OIDE YASUSHI
分类号 H05K3/46 主分类号 H05K3/46
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