PROCESS FOR PRODUCTION OF CIRCUIT BOARD

摘要

Disclosed is a process for producing a circuit board, which can prevent the separation of solder bumps during the formation of the solder bumps, can also prevent the formation of needle-like crystals, and enables the steady production of a normal circuit board. The process for producing a circuit board is characterized by comprising the steps of: applying an adhesiveness-imparting compound onto the surface of a terminal arranged on a circuit board to form an adhesive layer; attaching solder particles onto the adhesive layer; applying an activating agent containing a hydrohalic acid salt of an organic acid base onto the solder particles and heating the circuit board on which the solder particles have been attached at a temperature equal to or lower than the melting temperature of the solder to fix the solder particles; applying a flux onto the circuit board on which the solder particles have been fixed; and heating the circuit board to melt the solder particles.