| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board for electronic component inspection and a manufacturing method thereof for collecting examination information of inspected electronic components correctly. <P>SOLUTION: The wiring board 1 for electronic component inspection includes a first laminate C1 composed of ceramic layers of s1 to s3, having a pad 6 formed on a front surface 2, wiring layers 7 and 8 between the ceramic layers s1 to s3, and a via-conductor v connecting a pad 6 between the wiring layers 7 and 8 and a rear surface 3 and a second laminate C2 composed of ceramic layers of s4 to s6 made of the same material composition as aforementioned, having a plural of via-conductors V penetrating between a front surface 4 and a rear surface 5 to be laminated over the side of a rear surface 3 of the first laminate C1, and a plurality of lands 10 connecting a via-conductor v exposed on the rear surface 3 of the first laminate C1 and a via-conductor V exposed on the front surface 4 of the second laminate C2 and a wiring layer 9 located at surroundings thereof are arranged between the first laminate C1 and the second laminate C2, the diameter of the land 10 concerned being 2 to 5 times larger than the diameter of the via-conductors v and V. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
