发明名称 |
POLISHING APPARATUS AND POLISHING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To allow more precise control of a polishing profile to be performed without carrying out many polishing tests in advance. SOLUTION: A polishing apparatus includes: a polishing table 22 having a polishing surface 52a; a top ring 24 for holding a polishing object W and pressing it against the polishing surface 52a; a polishing liquid supply nozzle 26 for supplying a polishing liquid to the polishing surface 52a; a movement mechanism 70 for moving a polishing liquid supply position 26a of the polishing liquid supply nozzle 26 approximately along a radial direction of the polishing surface 52a; a controller 66 for controlling the movement mechanism 70; and a simulator 72 for predicting the relationship between the polishing liquid supply position 26a of the polishing liquid supply nozzle 26 and the polishing profile, performing a simulation and outputting data to the controller. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010247258(A) |
申请公布日期 |
2010.11.04 |
申请号 |
JP20090097692 |
申请日期 |
2009.04.14 |
申请人 |
EBARA CORP |
发明人 |
ISHII YU;SHIOKAWA YOICHI;MATSUO NAONORI |
分类号 |
B24B37/00;B24B49/02;B24B49/10;B24B49/12;H01L21/304 |
主分类号 |
B24B37/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|