PURPOSE: A wafer mounting device and a method thereof are provided to prevent the physical damage of a wafer by attaching a wafer to a tape through the pressure difference. CONSTITUTION: A vacuum chamber(120) is formed under a top cover(110) into a cylindrical shape. The top cover opens and closes the top of the vacuum chamber. A wafer chuck(140) lifts and lowers according to the lifting and lowering of a moving base(123) inside the vacuum chamber. A ring frame(RF) divides the vacuum chamber into an upper chamber and a lower chamber with a tape attached to the upper side. A drive motor unit(170) lifts and lowers the moving base.
