发明名称 |
SOLID-STATE IMAGE PICKUP DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid-state image pickup device providing a light receiving unit of a larger area under restrictions by a size of a semiconductor wafer as material. <P>SOLUTION: The solid-state image pickup device 1 includes: a light receiving unit 10 in which a plurality of pixels 11 each including a photodiode PD are two-dimensionally arranged into M rows and N columns; N read lines 12 disposed on a per-column basis and each connected through a read switch SWa to the photodiodes PD included in the pixels 11 in the corresponding column; a signal output unit 20 for outputting voltage values corresponding to respective charge amounts input via the read lines 12; and a vertical shift register 30 for controlling opening/closing operation of the read switch SWa on a per-row basis. An outline between a side 10b along a row direction of the light receiving unit 10 and a pair of sides 10c, 10d along the column direction has a step-like shape. A dummy photodiode region 70 is formed along a step-like outline of the light receiving unit 10. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010245110(A) |
申请公布日期 |
2010.10.28 |
申请号 |
JP20090089247 |
申请日期 |
2009.04.01 |
申请人 |
HAMAMATSU PHOTONICS KK |
发明人 |
MORI HARUMICHI;KUSHIMA TATSUJI;FUJITA KAZUKI |
分类号 |
H01L27/146;A61B6/03;A61B6/14;H01L27/14;H01L27/144;H04N5/335;H04N5/369;H04N5/374 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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