发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a solid-state image pickup device providing a light receiving unit of a larger area under restrictions by a size of a semiconductor wafer as material. <P>SOLUTION: The solid-state image pickup device 1 includes: a light receiving unit 10 in which a plurality of pixels 11 each including a photodiode PD are two-dimensionally arranged into M rows and N columns; N read lines 12 disposed on a per-column basis and each connected through a read switch SWa to the photodiodes PD included in the pixels 11 in the corresponding column; a signal output unit 20 for outputting voltage values corresponding to respective charge amounts input via the read lines 12; and a vertical shift register 30 for controlling opening/closing operation of the read switch SWa on a per-row basis. An outline between a side 10b along a row direction of the light receiving unit 10 and a pair of sides 10c, 10d along the column direction has a step-like shape. A dummy photodiode region 70 is formed along a step-like outline of the light receiving unit 10. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010245110(A) 申请公布日期 2010.10.28
申请号 JP20090089247 申请日期 2009.04.01
申请人 HAMAMATSU PHOTONICS KK 发明人 MORI HARUMICHI;KUSHIMA TATSUJI;FUJITA KAZUKI
分类号 H01L27/146;A61B6/03;A61B6/14;H01L27/14;H01L27/144;H04N5/335;H04N5/369;H04N5/374 主分类号 H01L27/146
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