| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for mounting an electronic component thereon where no sealing failure occurs even if enlarging through-holes for fixing signal-terminals in order to increase the characteristic impedance of signal terminals, and provide an electronic device using the package. <P>SOLUTION: The package for mounting the electronic component thereon has a cap joining portion 1b present in the outer peripheral region of the upper surface thereof. The package has, in an inside portion of the upper surface, a base body 1 having a plurality of through-holes 2, 2 penetrating its upper surface and lower surface which also penetrate a mounting portion 1a of an electronic component 5. The package has signal terminals 4 which is fixed while penetrating shielding materials 3 filled in the through-holes 2. In the package, each through-hole 2 has a large-diameter portion 2a and a small-diameter portion 2b. The signal terminal 4 is fixed while penetrating the shielding material 3 filled in each large-diameter portion 2a. Between the adjacent through-holes 2, 2, positions of the large-diameter portion 2a and the small-diameter portion 2b are different from each other in the thickness direction of the base body 1. The large-diameter portions 2a, 2a overlap with each other partially in the upper view of the base body. By the foregoing facts, impedance matching can be performed even if the through-hole 2 is separated from the cap joining portion 1b to prevent a sealing failure. <P>COPYRIGHT: (C)2011,JPO&INPIT |
