| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing printed wiring board capable of forming a uniform plated film by dissolving variation of thickness of the plated film due to a position on a printed wiring board. SOLUTION: The method of manufacturing printed wiring board comprises: a process of immersing a board into a plating tank in which plating liquid is filled and a cathode is disposed, oppositely to an anode and connecting the board to the cathode; and a process of conducting electricity between the board and the cathode and generating a magnetic field between the board and the cathode to form a plating layer on the conductive layer surface of the board or on the through-hole or non-through-hole of insulating base material or an insulating layer of the board. COPYRIGHT: (C)2011,JPO&INPIT
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