| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film-forming resin composition capable of forming a resin film excellent in heat resistance, low dielectric and transparency, and to provide a photosensitive resin composition including the composition, etc. <P>SOLUTION: The film-forming resin composition including a polymer composed of structural units each represented by general formula (1) (wherein, X is a cage type structure; Y is an aromatic hydrocarbon group; R<SP>1</SP>and R<SP>2</SP>are each independently an acidic group or acidic group protected with acidolytic group; R<SP>3</SP>and R<SP>4</SP>are each independently H or optional substituent; (a) is an integer of 0-18; b is an integer of 0-6; c is an integer of 1-18, and d is an integer of 1-6; wherein, there are no cases that (a) is 0, and b is 0; and * each denotes the binding position between the mutually adjacent structural units) is provided. <P>COPYRIGHT: (C)2011,JPO&INPIT |
