发明名称 WAFER PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wafer processing device which prevents a damage of a wafer, cassette, and transferring means. SOLUTION: The wafer processing device is provided with: a wafer cassette 50; a cassette mounting stand 74; and a transferring means 54 which brings a wafer into a cassette or transfers it from the cassette. The transferring means is a wafer processing device which is disposed on the mounting stand movably forward/backward and brings a wafer into the cassette or transfers it from the cassette, and is equipped with: a collision detection mechanism 90 to detect the collision with the transferring means and the cassette or wafer; and a control means to control the transferring means. The mounting stand is fitted on a frame to be movable finely. The collision detection mechanism includes: an operation plate fixed with either one of the mounting stand and a frame; and a contact switch being disposed to the other of the mounting stand and the frame, against the operation plate, detects the collision by contact of a contact switch with the operation plate due to a fine movement of the mounting stand caused at a collision with the transferring means, a cassette or wafer, and makes the operation of the transferring means stop when detecting a collision. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010245476(A) 申请公布日期 2010.10.28
申请号 JP20090095608 申请日期 2009.04.10
申请人 DISCO ABRASIVE SYST LTD 发明人 MATSUHASHI RYO
分类号 H01L21/677 主分类号 H01L21/677
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