发明名称 PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID
摘要 A plating method comprising: (a) applying a plating catalyst liquid containing a catalytic element and an organic solvent, to an object to be plated having, at least at a surface thereof, a functional group capable of forming an interaction with the catalytic element; and (b) performing plating on the object to be plated, to which the plating catalyst liquid has been applied.
申请公布号 US2010272902(A1) 申请公布日期 2010.10.28
申请号 US20080810755 申请日期 2008.12.19
申请人 FUJIFILM CORPORATION 发明人 NAGASAKI HIDEO;SATO MASATAKA
分类号 B05D3/10;B01J35/00 主分类号 B05D3/10
代理机构 代理人
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