ULTRASONIC BONDING MACHINE FORMING CHIP CONTAINING GROOVE

摘要

PURPOSE: An ultrasonic bonding machine is provided to efficiently transmit vibration to a circuit chip by increasing a contact area between the circuit chip and a contact head. CONSTITUTION: A plurality of disturbance control grooves are formed on the outer surface of a body(120). An ultrasonic vibration unit(160) is arranged on the body and vibrates the body within an ultrasonic frequency range. A contact head(140) is arranged on the end of the body to vibrate with the body. A chip receiving groove is formed on the lower side of the contact head. The circuit chip is mounted on the chip receiving groove. An adhesion film is interposed between the circuit chip and the contact head.