| 摘要 |
PROBLEM TO BE SOLVED: To prevent damage to and corrosion of a wire bonding section and an IC substrate by shock, and to improve sealing properties of a reference section in a capacitive humidity sensor for adhering and fixing a sensor chip substrate having a sensor and the reference section and the IC substrate to the same support substrate and in a method of manufacturing the capacity type moisture sensor. SOLUTION: A protective member for covering the periphery of the sensor is provided on the sensor chip substrate; the support substrate is covered with a sealing resin by excluding a region surrounded by the protective member; the sensor is exposed to an atmosphere by the region surrounded by the protective member; and the reference section, a pad, a continuity wire, and the IC substrate are sealed outside the region surrounded by the protective member. COPYRIGHT: (C)2011,JPO&INPIT
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