| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive sheet which is utilized for dicing a semiconductor wafer or storing or carrying individual semiconductor chips, thereby preventing an underfill material from rising to the back surfaces of the semiconductor chips during flip-chip packaging of the semiconductor chips, as well as a method of manufacturing a semiconductor device using the adhesive sheet. <P>SOLUTION: The adhesive sheet 10 includes a base material 1 and an adhesive layer 2 formed on one surface of the base material. When the adhesive layer is pasted on the back surface of a semiconductor wafer having a surface where a circuit is formed and when the adhesive layer is peeled off the semiconductor wafer after 24 hours, a contact angle of tertiary butyl phenyl glycidyl ether on the back surface of the semiconductor wafer is 32.0°or more. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
