摘要 |
A laser machining device (100) is provided with a laser source (101) for emitting a laser beam (L) and a laser source control unit (102) for controlling the pulse width of the laser beam (L), and by emitting the laser beam (L) while adjusting a focus (P) to the inside of an object to be machined (1), forms a reformed area on the object to be machined (1) along a predicted cutting line (5) of the object to be machined (1) and produces a crack extending along the thickness direction of the object to be machined (1) from the reformed area by the formation of the reformed area. In the laser machining device (100), the pulse width of the laser beam (L) is varied by the laser source control unit (102) according to a data table configured by associating "the length of the crack", "the thickness of the object to be machined (1)", and "the pulse width of the laser beam (L)" with one another. More specifically, the pulse width is varied on the basis of the length of the crack produced from the reformed area. Thus, in the laser machining device (100), the crack having a desired length can be produced from the reformed area. |