| 摘要 |
A fluid-ejecting device with simplified connectivity is disclosed herein. According to an embodiment of the present invention, a common lead is provided such that a plurality of electrical contacts on a fluid-ejecting chip are connected to the common lead, which is located on a single-layer-flex circuit. Because a common lead is provided at an edge of the single-layer-flex circuit adjacent the fluid-ejecting chip, fewer signals need to be routed through the single-layer-flex circuit to such edge, thereby reducing the complexity of such circuit. Further, bond sites at the edge of the single-layer-flex circuit adjacent the fluid-ejecting device are arranged in a manner that minimizes the required length of wire bonds for connecting such contacts to the contacts on the fluid-ejecting chip.
|
