Methodology for creating layered panel structure including self-bonded thermoformable and non-thermoformable layer materials

摘要

A method of forming a layered, generally planar panel structure including the steps of (a) utilizing applied heat and pressure, causing a melt of resin present in a thermoformable material layer to flow toward and into an adjacent non-thermoformable material layer, and (b) by such utilizing and causing, forming a thermal-compression, mechanical, inter-material-transition bond between the layers.