Semiconductor optical communication module and manufacturing method thereof

摘要

A semiconductor optical communication module includes a semiconductor chip mounted on a chip carrier and a lens assembly having an end parallel to and facing the front edge of the chip carrier. The semiconductor chip has a front facet oriented at an acute angle to the front edge of the chip carrier. An optical waveguide in the semiconductor chip transmits an optical signal that propagates on an optical axis extending from the front facet of the semiconductor chip to the end of the lens assembly. The optical axis is orthogonal to the end of the lens assembly and the front edge of the chip carrier. The angled mounting of the semiconductor chip on the chip carrier allows the lens assembly to be placed close to the edge of the chip carrier, and to be moved for optical axis adjustment without striking the chip carrier.