摘要 |
The invention describes an arrangement (1) for holding a substrate (10) in a material deposition apparatus (50), which substrate (10) has a deposition side (10a) upon which material (M) is to be deposited, and which arrangement (1) comprises a shadow mask (20) comprising a number of deposition openings (D1); a support structure (30) comprising a number of surround openings (S1); and a support structure holding means (6) for holding the support structure (30) and/or a substrate holding means (5) for holding the substrate (10), such that the support structure k (30) is on the same side as the deposition side (10a) of the substrate (10), and the shadow mask (20) is positioned between the substrate (10) and the support structure (30) such that at least one deposition opening (D1) of the shadow mask (10) lies within a corresponding surround opening (S1) of the support structure (30). The invention further describes a material deposition apparatus (50) comprising an arrangement (1) for holding a substrate (10). The invention also describes a method of arranging a substrate (10), a shadow mask (10) and a support structure (30) in a material deposition apparatus (50). |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N. V.;PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH;OSRAM OPTO SEMICONDUCTORS GMBH;KRIJNE, JOHANNES;EILING, ERWIN;HOHAUS, KARL-HEINZ;GOERGEN, WOLFGANG;LOVICH, ANDREAS;PHILIPPENS, MARC;SCHEICHER, RICHARD;FISCHER, ANSGAR;MUELLER, MARTIN |
发明人 |
KRIJNE, JOHANNES;EILING, ERWIN;HOHAUS, KARL-HEINZ;GOERGEN, WOLFGANG;PHILIPPENS, MARC;SCHEICHER, RICHARD;FISCHER, ANSGAR;MUELLER, MARTIN |