| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and development processing method for suitably removing dissolution product on a resist film. SOLUTION: The substrate treatment apparatus includes a holding portion 11 for rotatably holding a substrate, a first developer nozzle 13 for supplying bubble-containing developer which bubbles are mixed in the developer, to the substrate, and a control portion 19 for supplying the bubble-containing developer to the substrate W by the first developer nozzle 13 and developing the substrate W. The bubbles mixed in the bubble-containing developer moves the dissolution product of the resist film by its interface energy. Therefore, when the bubble-containing developer is supplied to the substrate, the resist film is dissolved and at the same time, the dissolved dissolution product is suitably removed from the substrate. COPYRIGHT: (C)2011,JPO&INPIT
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