| 摘要 |
A method for producing a soldered connection between two components (1, 2, 11) and a device suited for carrying out the method are described. It is provided that a solder layer (5, 15 to 18) is applied onto at least one of the components (1, 2, 11) and that electric current that is fed by at least two electrodes (6a, 6b) is conducted through the solder layer (5, 15 to 18) in order to melt at least part of the solder, wherein the at least two electrodes (6a, 6b) come in direct contact with the solder layer (5, 15 to 18). |
