PURPOSE: A heat sink for packaging a light emitting device is provided to obtain an excellent heat radiation effect by forming heat radiation protrusions having at least one penetration hole. CONSTITUTION: A heat sink(300) for a light emitting device package comprises a heat radiation projection(310) equipped with a plurality of heat radiation protrusions. The heat radiation projection are arranged to maximize radiation efficiency through air. The heat radiation projection has a horizontal penetration hole and a vertical penetration hole. The heat radiation projection is divided into nine partitions by penetration holes.
申请公布号
KR20100106138(A)
申请公布日期
2010.10.01
申请号
KR20090024616
申请日期
2009.03.23
申请人
KUMHO ELECTRIC INC.
发明人
LEE, JONG CHAN;WEON, HYO JIN;HER, IN SUNG;CHOI, GI SEUNG;KIM, MIN SU