发明名称 Method of fabricating semiconductor device
摘要 There is provided a method of fabricating a semiconductor device having plural light receiving elements, and having an amplifying element, the method including: a) forming an active region on the semiconductor substrate for configuring the amplifying element; b) forming a light receiving element region on the semiconductor substrate for forming the plural light receiving elements, with the active region acting as a reference for positioning; c) implanting an impurity into the light receiving element region; d) repeating the process b) and the process c) a number of times that equals a number of diffusion layers in the light receiving element region; e) after implanting the impurity, performing a drive-in process to carry out drive in of the semiconductor substrate; and f) the process e), forming an amplifying element forming process by implanting an impurity in the active region.
申请公布号 US2010248410(A1) 申请公布日期 2010.09.30
申请号 US20100659601 申请日期 2010.03.15
申请人 OKI SEMICONDUCTOR CO., LTD. 发明人 OKAMURA TOMOHIRO;OKIHARA MASAO
分类号 H01L31/18 主分类号 H01L31/18
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