| 摘要 |
A method of fabricating a circuit board includes: forming an adhesion auxiliary layer on a surface of an insulating base board; forming an adhesion layer on a surface of the adhesion auxiliary layer, the adhesion layer comprising a polymer compound having a polymerizable group and a functional group capable of interacting with a plating catalyst or a precursor thereof; fixing the adhesion layer to the adhesion auxiliary layer by applying energy to the adhesion layer; applying a plating catalyst or a precursor thereof to the adhesion layer; forming a first metal film by electroless plating on the adhesion layer; and performing electroplating by using the first metal film; and the method further includes partly removing, by irradiating a laser beam, an area corresponding to a non-circuit portion in any of the adhesion auxiliary layer, the adhesion layer, or the first metal film.
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