| 摘要 |
<p>Disclosed is a sputter deposition device provided with a conductive target holder and a conductive substrate holder facing the target holder. The target holder holds a target and the substrate holder holds a substrate. A voltage is applied to both the target holder and the substrate holder, sputtering the target and forming on the substrate an insulating film containing elements that make up the target. The substrate holder has gaps formed facing the discharge space, sized such that, during sputter deposition, insulating particles that are to form the aforementioned insulating film do not reach the inner walls of the gaps, thereby securing a conductive surface open towards the discharge space.</p> |
