RESIN COMPOSITION, PREPREG, LAMINATED SHEET AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition which has sufficient flexibility to prevent cracking from occurring therein when a prepreg is formed, further the prepreg having sufficient flexibility to prevent cracking from occurring, and furthermore the prepreg having excellent workability even if the resin composition in the prepreg is in an uncured state and a printed wiring board including this.

SOLUTION: This resin composition used to form a sheet-shaped prepreg 1 by impregnating a base material with the resin composition includes: a first thermosetting resin; a second thermosetting resin having a lower weight average molecular weight than that of the first thermosetting resin; a curing agent; and a filler. This prepreg 1 is formed by impregnating a sheet-shaped base sheet material 11 with the above-described resin composition. This printed wiring board is formed by laminating a metallic foil 23 on the above-described prepreg 1 and then molding them by heating under pressure. This package 3 is manufactured by mounting an IC chip 33 on a prepreg 31 on which the metallic foil is laminated.

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