Component i.e. housing cover, producing method for electrical devices, involves running molecular structure of component from inner side into outer side of component, and forming symbol, number, letter or word by lines in unique position

摘要

The method involves stamping recesses (11) into a wall (2) of a component (1) i.e. housing cover, before hardening a molecular structure of the component during production of lines into a surface of the recesses. The molecular structure of the component runs from an inner side (6) into an outer side (3) of the component, where a symbol, number, letter or word is formed by the lines in a unique position. An embossing stamp (12) is inserted for production of the recesses, where the embossing stamp has two differently measured embossing levels (13, 14).