发明名称 LED MODULE USING METAL SUBSTRATE AND METHOD THEREOF
摘要 <p>PURPOSE: An LED module using a metal substrate and a manufacturing method thereof are provided to efficiently discharge heat emitted from an LED device. CONSTITUTION: A plurality of electrode layers are comprised of an insulation layer and an upper metal substrate and are repeatedly formed on a lower metal substrate. A mounting groove(140) is formed by partially etching an electrode layer to expose the surface of a lower metal substrate(100) for mounting a plurality of LEDs. The plurality of LEDs are mounted on the mounting groove. The LEDs are wire-bonded with each upper metal substrate of the electrode layer.</p>
申请公布号 KR20100103284(A) 申请公布日期 2010.09.27
申请号 KR20090021838 申请日期 2009.03.13
申请人 KOREA POLYTECHNIC UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION 发明人 NAM, CHOONG MO
分类号 H01L33/64;H01L33/62 主分类号 H01L33/64
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