发明名称 CUTTING DEVICE AND CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To correctly cut even an adhesive material to be cut and surely separate it from a blade. SOLUTION: A cutting device 2 includes a fixed plate 3, a movable plate 4 provided to be vertically movable above the fixed plate 3 and having a blade 5 exchangeably provided on a lower side, a drive controller 20 for moving the movable plate 4 up and down, and a feed mechanism 40 for moving the material 41 to be cut on the fixed plate 3. It also includes a suction mechanism 60 which is moved toward the movable plate 4 side together with the material 41 mounted on the fixed plate 3 by the feed mechanism 40, and an air ejection mechanism 50 for ejecting the air to the movable plate 4 downward from the blade 5. The cutting device 2 sucks the material 41 under a negative pressure on the fixed plate 3 by the suction mechanism 60 and ejects the air toward the material 41 by the air ejection mechanism 50 when moving up/down the movable plate 4 by the drive controller 20 to cut the material 41. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010207925(A) 申请公布日期 2010.09.24
申请号 JP20090053556 申请日期 2009.03.06
申请人 AKEBONO KIKAI KOGYO KK 发明人 SHIONOYA KENJI
分类号 B26D7/18;B26D7/02;B26D7/06;B26D7/08 主分类号 B26D7/18
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