发明名称 ELECTRICAL CONNECTION DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To suppress variations in the height position and coordinate position of a needle resulting from the thermal deformation of a support and a probe substrate, as much as possible. Ž<P>SOLUTION: The electrical connection device includes the support having a lower surface, the probe substrate that is attached to the lower surface of the support and supported by the support, and a plurality of contacts attached to the lower surface of the probe substrate. At least one of the support and the probe substrate has a temperature-adjusting member for receiving electric power and generating or absorbing heat. The support and the probe substrate are made of materials having substantially the same thermal expansion coefficient. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010210587(A) 申请公布日期 2010.09.24
申请号 JP20090059940 申请日期 2009.03.12
申请人 MICRONICS JAPAN CO LTD 发明人 HASEGAWA MASASHI;NARITA TOSHIO
分类号 G01R1/073;G01R31/26;H01L21/66 主分类号 G01R1/073
代理机构 代理人
主权项
地址