| 摘要 |
<P>PROBLEM TO BE SOLVED: To properly remove heat generated from a semiconductor and electromagnetic noise from the outside. Ž<P>SOLUTION: A semiconductor circuit device includes a substrate 4, including a conductive pattern 3 containing a GND 8; the tabular semiconductor 5 loaded on the substrate 4 and connected to a part of the conductive pattern 3; and an envelope 6, including a conductor 7 which includes an opening S with the outer peripheral surface of the semiconductor 5 and is mounted so as to surround the semiconductor 5 on the substrate 4. The GND 8 for the conductive pattern 3 for the substrate 4 and the conductor 7 for the envelope 6 are electrically connected. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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