| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board for suppressing performance deterioration caused by thermal stress and to provide a method for manufacturing the wiring board. <P>SOLUTION: The wiring board 10 including an electronic component includes: the electronic component 200 arranged in an opening section of a substrate 100; an adhesive 200a (insulating material) formed in gaps between the substrate 100 and the electronic component 200; and a first conductive layer 110a formed on the adhesive 200a. Terminal electrodes 210, 220 in the electronic component 200 are connected to a conductive pattern included in the first conductive layer 110a through via holes 201a, 202a formed on the adhesive 200a. Where, the height of the via holes 201a, 202a is set in a range of 5 to 15μm and the aspect ratio of the via holes 201a, 202a is set in a range of 0.07 to 0.33. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
