发明名称 |
Apparatus for Applying a Plating Solution for Electroless Deposition |
摘要 |
An electroless plating chamber is provided. The electroless plating chamber includes a chuck configured to support a substrate and a bowl surrounding a base and a sidewall of the chuck. The base has an annular channel defined along an inner diameter of the base. The chamber includes a drain connected to the annular channel. The drain is capable of removing fluid collected from the chuck. A proximity head capable of cleaning and substantially drying the substrate is included in the chamber. A method for performing an electroless plating operation is also provided.
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申请公布号 |
US2010239767(A1) |
申请公布日期 |
2010.09.23 |
申请号 |
US20100790558 |
申请日期 |
2010.05.28 |
申请人 |
DORDI YEZDI;THIE WILLIAM;BOYD JOHN M;REDEKER FRITZ C;OWCZARZ ALEKSANDER |
发明人 |
DORDI YEZDI;THIE WILLIAM;BOYD JOHN M.;REDEKER FRITZ C.;OWCZARZ ALEKSANDER |
分类号 |
B05D3/00 |
主分类号 |
B05D3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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