| 摘要 |
A multilayer surrounding plate type heat dissipating structure comprises: a heat dissipating base module 10; a heat conducting column 20, with an end coupled to the heat dissipating base module 10, and another end having a distal head portion 21; at least one light emitting element 30, installed at the distal head portion 21 of the heat conducting column 20; and a multilayer surrounding plate 40, installed to a ceiling 50, and having a through hole 43 formed thereon, for passing the heat conducting column 20, such that a heat source produced by the light emitting element 30 can be dissipated through the multilayer surrounding plate 40 or an airflow passage between multilayer surrounding plate 40 to achieve an excellent heat dissipating effect, assure the functions of the light emitting element 30, and extend their lifespan. |
