发明名称 AUTOMATIC CURING SYSTEM FOR AN ELECTROIC COMPONENTS
摘要 PURPOSE: A thermoplastic processing device of an electronic part is provided to sequentially arrange a series of processes in a line and automatically execute the processes. CONSTITUTION: A first chamber(2) for preheat and a second chamber(3) for a thermoplastic process, and a third chamber(4) for cooling are sequentially and adjacently placed on a frame(1). A substrate supplier(6) is arranged in the inlet part of the first chamber. A substrate discharging part(7) is prepared in the vent of the third chamber. The first chamber stores a magazine which includes a substrate. The second chamber stores a plurality of magazines which includes a substrate for processing inside.
申请公布号 KR20100101783(A) 申请公布日期 2010.09.20
申请号 KR20090020147 申请日期 2009.03.10
申请人 ASEEN TECH SYSTEM ENGINEERING 发明人 LEE, MUN GYU
分类号 H01L21/324;H01L21/00 主分类号 H01L21/324
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