| 摘要 |
<p>PURPOSE: A metal line which the package structure of the semiconductor device interlinks the semiconductor chip and lead frame and extrinsic it is combined it goes in gear with the lower can. CONSTITUTION: For the lower can, the semiconductor chip(200) is arranged in the inner side. The lead frame(210) passes through in the lower can outside and it is arranged in the inner side. The metal line(215) interlinks the semiconductor chip and lead frame. While being combined to go in gear with the lower can, the top heat spreader in which the external atmosphere and contact surface many and which is superficially formed is included.</p> |
