发明名称 METHOD OF MANUFACTURING POLYIMIDE RESIN MOLD AND POLYAMIC ACID FILM
摘要 PROBLEM TO BE SOLVED: To provide a method capable of easily manufacturing a polyimide resin mold having a high dimensional stability, and having a small thickness. SOLUTION: This manufacturing method of the polyimide resin mold is provide for forming imide by setting a polyamic acid film having a tensile elastic modulus of 900-1,500 MPa and an elongation of 30-60% in a mold. The polyamic acid film is desirably dried until a residual solvent quantity becomes 5-18 mass% by applying a solution of a polyamic acid on a support. A desirable thickness of the polyimide resin mold provided by this manufacturing method is 10-500μm. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010201871(A) 申请公布日期 2010.09.16
申请号 JP20090052430 申请日期 2009.03.05
申请人 NITTO DENKO CORP 发明人 TAKAYAMA YOSHINARI
分类号 B29C51/02;B29C41/12;B29K79/00;B29L7/00;C08J5/18 主分类号 B29C51/02
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