| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer processing method and a wafer processing device attaining economic formation of a uniform-thickness adhesive film for die-bonding on the rear surface of a wafer. <P>SOLUTION: The wafer processing method of forming the adhesive film for die-bonding on the rear surface of the wafer on the front surface of which a plurality of devices are formed includes the adhesive applying step of applying a liquefied adhesive for die-bonding of a viscosity of 5,000-10,000 cps by screen printing on the rear surface of the wafer which is held on a rotatable holding table with the rear surface upward to coat the adhesive film on the rear surface of the wafer, and the adhesive smoothing-out step of smoothing out the adhesive film by rotating the holding table at a rotational speed of 700-1,000 rpm to exert the centrifugal force onto the adhesive film coated on the rear surface of the wafer, thereby forming the uniform thickness adhesive film on the rear surface of the wafer. <P>COPYRIGHT: (C)2010,JPO&INPIT |
