发明名称 Substrate strip and substrate structure and method for manufacturing the same
摘要 A substrate structure is disclosed. The substrate structure includes a core substrate, an interconnection portion and a solder mask. The core substrate includes a top surface and a bottom surface opposite the top surface. A circuit pattern is disposed on the top surface. The interconnection portion is disposed on the top surface; herein the interconnection portion includes a surface dielectric layer and a surface circuit layer disposed on the surface dielectric layer. The surface circuit layer is electrically connected to the circuit pattern. The solder mask is disposed on the interconnection portion; herein the solder mask includes a hole to identify the substrate structure. Besides, a method for manufacturing the substrate structure is disclosed.
申请公布号 US7795722(B2) 申请公布日期 2010.09.14
申请号 US20060617138 申请日期 2006.12.28
申请人 ADVANCED SEMICONDUCTOR ENGINEERING INC. 发明人 CHAN SHU-LUAN;HUANG CHI-CHIH;CHANG SHUO-HSUN
分类号 H01L23/053 主分类号 H01L23/053
代理机构 代理人
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