发明名称 |
Substrate strip and substrate structure and method for manufacturing the same |
摘要 |
A substrate structure is disclosed. The substrate structure includes a core substrate, an interconnection portion and a solder mask. The core substrate includes a top surface and a bottom surface opposite the top surface. A circuit pattern is disposed on the top surface. The interconnection portion is disposed on the top surface; herein the interconnection portion includes a surface dielectric layer and a surface circuit layer disposed on the surface dielectric layer. The surface circuit layer is electrically connected to the circuit pattern. The solder mask is disposed on the interconnection portion; herein the solder mask includes a hole to identify the substrate structure. Besides, a method for manufacturing the substrate structure is disclosed.
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申请公布号 |
US7795722(B2) |
申请公布日期 |
2010.09.14 |
申请号 |
US20060617138 |
申请日期 |
2006.12.28 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING INC. |
发明人 |
CHAN SHU-LUAN;HUANG CHI-CHIH;CHANG SHUO-HSUN |
分类号 |
H01L23/053 |
主分类号 |
H01L23/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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