发明名称 BONDING METHOD AND DEVICE MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To make it possible to make a junction at low cost and in a short time by keeping pressuring force on each bonding member constant without distorted weighting under the condition that a plurality of bonding members lie with a small amount of spacing between the adjacent members on a substrate. <P>SOLUTION: A hardened substance 7 of elastic modulus A is laid on the surface of a plurality of bonding members 2. Using a pressure jig 5, the hardened substance 7 is transformed or elastically transformed, and the opposite surface (a surface on the side of the bonding member 2) of a surface that each hardened substance 7 touches is made a plane surface. After the hardened substance 7 is hardened by ultraviolet (UV) or heat to have elastic modulus B (B>A), each surface touched by the hardened substance 7 and the opposite side surface with the pressure jig 5 is pressurized and heated, and pushed in the direction of a substrate 1, and then the bonding section 3 of a substrate 1 is made a junction with the bonding member 2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010199190(A) 申请公布日期 2010.09.09
申请号 JP20090040590 申请日期 2009.02.24
申请人 PANASONIC CORP 发明人 OMURA TAKASHI
分类号 H01L21/603;B23K3/00;B23K101/40;B81C99/00;H01L25/04;H01L25/18;H05K3/38 主分类号 H01L21/603
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