发明名称 RESIN COMPOSITION AND RESIN CURED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a resin composition giving a uniform resin cured product with high electric insulation property and heat conductivity and being excellent in moldability, and a uniform resin cured product with high electric insulation property and heat conductivity. SOLUTION: The resin composition contains a compound having a liquid crystal unit containing a mesogen group, flexible units bonded to both ends of the liquid crystal unit, and a polymerizable group at a terminal end. The flexible unit is a resin composition, i.e., one kind or more of groups selected from the group consisting of a group represented by formula: (wherein, n is an integer of 4 or more). Further, the resin cured product is obtained by polymerizing the resin composition. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010196015(A) 申请公布日期 2010.09.09
申请号 JP20090045732 申请日期 2009.02.27
申请人 MITSUBISHI ELECTRIC CORP;TOKYO INSTITUTE OF TECHNOLOGY 发明人 MIMURA KENJI;NAKAMURA KAZUKI;KAKIMOTO MASAAKI;URUSHIBATA HIROAKI;HAYAKAWA TERUAKI;MAEDA RINA
分类号 C08G59/20;C08G59/40;C08K3/00;C08L63/00 主分类号 C08G59/20
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