| 摘要 |
A method for fabricating an array of semiconductor devices comprising the steps of providing a non-metallic substrate, placing a layer of spheres on said substrate, reducing diameter of the spheres, encapsulating the spheres in a matrix of rigid material, finishing an upper surface of said matrix to expose a portion of said spheres, removing the spheres to form an array of cavities within said matrix, and forming features in said cavities in contact with said substrate so as to form the device.
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