FINE THROUGH HOLE SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME

摘要

<P>PROBLEM TO BE SOLVED: To provide a fine through hole substrate that suppresses peeling of a metal film of ≥5 μm in thickness from the fine through hole substrate, and to provide a method of manufacturing the same. Ž<P>SOLUTION: The fine through hole substrate includes: a substrate 2 in which a through hole 1 is formed; the metal layer 3 provided on one surface side of the substrate 2 and having a thickness of ≥5 μm; and a lock member 4 formed in the through hole 1 and made of a metal material, wherein the lock member 4 and metal layer 3 are coupled together in one body, the lock member 4 is locked in the through hole 1, and the metal layer 3 coupled to the lock member 4 in the one body is joined to the one surface side of the substrate 2. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž