| 发明名称 |
ADHESIVE RESIN COMPOSITION, AND LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a non-halogen-based adhesive composition excellent in adhesiveness, solder heat resistance, flame retardancy as well as flow characteristics, and to provide a laminate and a flexible printed wiring board using the composition. <P>SOLUTION: The adhesive resin composition contains: a phosphorus-containing epoxy resin and/or a phenoxy resin; a phosphorus-containing polyester having a weight-average molecular weight of over 20,000 to 150,000; other thermoplastic resin; and a curing agent. It is preferable that the composition further contains a benzoxazine compound, but an inorganic filler is not substantially compounded therein. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
| 申请公布号 |
JP2010195887(A) |
申请公布日期 |
2010.09.09 |
| 申请号 |
JP20090040579 |
申请日期 |
2009.02.24 |
| 申请人 |
SUMITOMO ELECTRIC IND LTD;SUMITOMO ELECTRIC PRINTED CIRCUIT INC |
发明人 |
KAIMORI SHINGO;SUGAWARA JUN;MIZOGUCHI AKIRA;ASAI SHOGO;YOSHIZAKA TAKUMA;UENISHI NAOTA |
| 分类号 |
C09J163/00;B32B15/08;B32B27/00;B32B27/38;C09J5/00;C09J7/00;C09J11/00;C09J167/00;C09J171/10;C09J177/00;C09J179/04;C09J201/00;H05K1/03 |
主分类号 |
C09J163/00 |
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